CCP RIE Inquiry Categories: Reactive-Ion Etching Categories Menu Deposition System Thermo Evaporator E-Beam Evaporator Quantum Computing Deposition System Magnetron Sputtering Systems Molecular Beam Epitaxy (MBE) Pulsed Laser Deposition (PLD) Ion-Beam Sputter Deposition _IBSD Linear and cluster system Plasma System Reactive-Ion Etching ( RIE ) Inductively Coupled Plasma ( ICP ) Electron Cyclotron Resonance ( ECR ) Ion Beam Etching Uhv Design & Components Laser Heating CCP RIE Include 4 inch Wafer Etching Water cooling LN2 optional Cooling RF Plasma from Top by CCP Better Uniformity than RIE Smaller Etching rate
